€20.7m · Series A · Deeptech · Eindhoven, Netherlands
Keiron Printing Technologies has closed a €20.7 million Series A to scale its laser-based solder-paste printing systems for electronics manufacturers. The Eindhoven company said the round was co-led by Invest-NL, DeepTechXL and Waves Capital, with Ramphastos Investments, ATUM Ventures, Cottonwood Technology Fund and TNO Ventures also participating.
Invest-NL committed €6.9 million and said the financing will help Keiron validate its technology with customers, scale its first systems, build a service organisation and develop the next generation of its platform. Keiron separately said it plans to expand production, commercial coverage and technical support across Europe, North America and Asia-Pacific.
Turning solder-paste printing into a digital process
Keiron targets an early step in printed-circuit-board assembly: placing solder paste before electronic components are mounted. Conventional lines typically use physical stencils, while jet systems depend on specialised dispensing hardware. Keiron’s HF2 instead uses Laser-Induced Forward Transfer to deposit standard solder paste without contact, and combines printing with three-dimensional paste measurement in the same machine.
The commercial argument is strongest in high-mix, low-to-medium-volume production, where manufacturers change designs frequently and the tooling, setup and inspection around each run can slow the line. Keiron says removing stencils, nozzles and a separate inspection step can shorten changeovers and reduce rework. Those performance figures remain company claims, but the underlying mechanism is concrete: software-defined deposition lets a manufacturer change the print pattern without first fabricating and managing a new stencil.
The Series A therefore finances more than additional machine output. Customer validation, service capacity and regional support determine whether a new production tool can move from demonstrations into repeatable use on factory lines. Keiron’s product page names VDL TBP Electronics as a collaborator and quotes its managing director on the combination of flexibility and speed, providing some evidence of industrial engagement without disclosing commercial volumes.
Keiron traces the technology to a project begun at TNO Holst Centre in 2012 and says the company was founded as a spin-out in 2019. It took the HF2 on a six-country European roadshow in 2025 and demonstrated it in North America at APEX Expo in 2026. The new capital is aimed at converting that visibility into installed systems and support infrastructure while continuing platform development with TNO as a strategic research partner.
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Jarna Hyvönen, Volare: Why Climate Hardware Startups Need a New Funding Playbook — EUVC interview · 24 April 2026. The conversation examines how industrial hardware moves from technical validation to operating-scale evidence, with capital structure, infrastructure and unit economics tested under real conditions.
Sources checked:
Keiron announcement · Invest-NL announcement · Keiron HF2 product page · Keiron company history · Tech.eu Funding Explorer
Image: Keiron Printing Technologies, via Invest-NL.
