€15m equity + €76m non-dilutive · Series A · Deeptech · Munich, Germany
QuantumDiamonds, a Munich deeptech company developing quantum-diamond sensing systems for semiconductor inspection, has secured €15m in Series A equity led by World Fund. Bayern Kapital made a significant investment, while existing investors IQ Capital, Earlybird, First Momentum, UnternehmerTUM, Creator Fund, Onsight Ventures and angel investors also participated, according to the company's announcement.
The equity sits alongside €76m in non-dilutive funding approved under the European Chips Act and jointly provided by Germany's federal government and Bavaria, bringing the total financing package to €91m. The company says the capital will support deliveries of laboratory systems to chipmakers and development of wafer-level, high-throughput inspection for semiconductor fabs.
Finding defects without destroying the wafer
QuantumDiamonds uses quantum sensors built around defects in synthetic diamonds to measure magnetic fields around semiconductor devices. Those measurements are intended to reveal electrical faults without cutting into or otherwise destroying the chip. For manufacturers, the practical value is a way to investigate failures while preserving the device for further analysis.
The company reports that its systems are already deployed with customers in the US and Taiwan and that it is ramping serial production in Munich. It also reports a team of about 70 people and plans to more than double engineering headcount over the next 12 months. Those operating milestones show that the financing is aimed at moving beyond a specialist laboratory tool towards repeatable production and customer delivery.
The financing bridges laboratory analysis and fab throughput
The commercial step is not simply selling more laboratory systems. Semiconductor fabs need inspection that works across wafers at production speed, with results that fit existing quality and process-control workflows. QuantumDiamonds therefore has to translate the sensitivity of its sensing approach into throughput, repeatability and integration that manufacturers can use at scale.
The €15m equity gives the company flexible capital for product and team expansion, while the larger non-dilutive component supports a capital-intensive technology programme without placing the full burden on shareholders. The package reduces financing pressure, but the business case will still turn on whether wafer-level inspection can meet fab requirements and shorten the costly cycle of locating and understanding defects.
